High performance Single Tower with 210W TDP
DolomitPremiumGerman engineering, an all-black heatsink combined with the multi-award winning Wing Boost 3 ARGB fans: The Dolomit Premium offers enough spare performance to efficiently cool the most demanding systems.
High-end heat pipes & copper base plate
6 high-end heat pipes with a large contact area on the nickel-plated Copper base plate ensure good heat pick-up at the CPU. Therefore the heat can be conducted to the large area fin stack quickly and efficiently.
All-black design
The heat sink is completely black and the stylish top fin rounds the design off. Further are all mounting parts kept black too.
Asymmetrical heat sink
The asymmetrical design of the Dolomit heat sinks allows maximum freedom when choosing RAM modules. No matter how high the heat spreader of the module is, it will fit without any problems. 100% RAM compatibility on the sockets 1200, 115X und AM4.
Wing Boost 3 ARGB
With its 16.8 million colours, the Wing Boost 3 ARGB offers numerous possibilities to put your case into the right light. The addressable RGB LED lighting is integrated into the fan housing, put a light shine onto the impeller, and also shines stylish to the outside.
Upgradable fan configuration
If even more performance is required, the kit contains four fan clips. This allows the mounting of an additional 120 mm fan on the back of the heat sink, increasing the cooling performance even further.
Thermal grease
The Thermal Grizzly Hydronaut thermal paste with its excellent thermal conductivity can also be used in the overclocking market. Advantages: No hardening, silicone free and not electrically conductive.
German Engineering
A perfect balancing act between performance and compatibility was achieved through intelligent material selection and a new Rock Mount 3 mounting system.
Compatibility
The enclosed mounting material allows secure installation on the following sockets:
- Intel LGA: 1200, 1150, 1151, 1155, 1156, 2066, 2011-v3, 2011
- AMD: AM4
Confezione:
Peso Lordo: 1,23 Kg
Dimensioni Lorde: 100x100x100 mm
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INTERSYSTEM Ingegneria Informatica S.r.l. Societ� a socio unico P.IVA 00865531008 CF 01203550353 CU MITWDG8 CCIA: 614171 � 2000-2019
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