High-grade thermal compound, Spatula + 3x NA-CW1 cleaning wipes, 2.49 g/cm³, 1.4 ml, 3.5 g, grey
SW (Spatula e Wipes) Edt. The SW (Spatula e Wipes) Edt. includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.
Not electrically conductive, non-corroding While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not.
Excellent long-term stability NT-H1's unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 Y and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 Y or more.
No break-in or burn-in required Some thermal compounds need a longer break-in period or cure time until they reach their full performance and some thermal pads must undergo a dedicated burn-in process. By contrast, NT-H1 is ready to go right away and doesn’t require any special preparations.
Confezione:
Peso Lordo: 0,04 Kg
Dimensioni Lorde: 210x20x150 mm
Tutti i prezzi NON sono comprensivi di IVA.
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INTERSYSTEM Ingegneria Informatica S.r.l. Societ� a socio unico P.IVA 00865531008 CF 01203550353 CU MITWDG8 CCIA: 614171 � 2000-2019
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